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Brief History

First recorded cemented chip thick panels known as Mevrit were developed by Mijnheer Muiselaar and Mijnheer de Vries during late 1930s in Holland through mixing of cement with waste wooden chips created in production of Dutch Clogs.  Method of production was innovated by Dr.Gohl in 1940s.

In mid-1960s Mr. Elmandort and Professor Moslemi in USA further developed cement chip panel closer to today’s form and sold the knowhow to the Swiss firm Durisol. First cemented chip panel production facility was established at Switzerland by Durisol and Bison companies in 1967.  The earthquake resistant prefabricated village schools built by Swiss Redcross in Kutahya region after the 1969 Gediz earthquake are based on first Durisol company products. Initially these panels were single layered, used large chips of standard size and hence had a porous texture. Later, in order to improve the surface quality of these panels, much smaller chips were used to form additional surfacing layers.

In the ensuing years, panel producing facilities utilizing the two basic construction materials spread around the world. Tepe Group began construction of a manufacturing facility in Ankara Beytepe on 26th September 1983 and began production trials on 22nd August 1984 with an annual capacity of 25,000m³.  While in the beginning this was a facility using the Bison company’s aerated double layer technology, with a modernization investment made in late 1999 the facility began employing its own mechanical three layer production system developed and increased its annual capacity to 35,000m³.  In 2001 another facility existing at Arhavi was purchased and the Company bacame the sole manufacturer in Turkiye and one of the leading firms in the world with its annual capacity of 50.000 m³.  In 2006 remodernization of certain infrastructure and addition of production lines, and by consolidating Arhavi manufacturing facility with Ankara Bilkent plant in 2008, production and shipment volume was focused in one location while the annual manufacturing capacity was raised to  67500 m³.

In new products developed  by Tepe Betopan®, chips were discontinued in panels manufactured during 2001 for the purpose of rendering products compatible with exterior use and new layers formed of inorganic granule mixed cement were introduced. Thus, in addition to “cement bonded particle boards” betopan® manufactured and sold since 1984, betopanplus® was launched and Tepe Betopan A.Ş. took its place among technology developing companies. Registered as betopanplus® brand, this patented new panel’s leading characteristic is its surface durability against external factors and reduction of motion by 55-60% caused by ambient relative humidity and the sun.

During the same period, due to positive results obtained in exterior applications, the same production lines were used to create through different methodologies wood and stone-like surface textures, respectively branded as yalıpan® and taşonit®.  Application of these uniquely textured panels in various architectural designs, enabled different exterior images. Subsequently, accessory components and details were manufactured from the same panels to be used on the exterior plastering  jointly with insulative materials applicable through disassembling construction systems to provide heat insulation. In response to great interest and demand in exterior surfacing panels and mounting system, in mid-2011 monolin®, frapan® and fugalin®, and in 2012 new surface texture products branded tuğpan® and tuğlapan® were designed  and added to the production line. Tepe Betopan® is one of the few world companies capable of developing its own systems to manufacture variety of innovative products.

TEPE BETOPAN A.Ş. has made in due course and continues to make significant contributions to the panel quality improvements and expansion of panel utility spectrum with its R&D dynamism and manufacturing infrastructure.